Three-dimensional integrated circuit and method for wireless information access thereof
US9086452B2 · kind B2 · utility
25Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2012 |
| Grant date | Jul 21, 2015 |
| Priority date | — |
| Expiry date | Jul 12, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A three-dimensional integrated circuit (3DIC) and wireless information access methods thereof are provided. The proposed 3DIC includes a semiconductor structure, and a wireless power device (WPD) formed on the semiconductor structure for wirelessly receiving a power for operating a function selected from a group consisting of probing the semiconductor structure, testing the semiconductor structure and accessing a first information from the semiconductor structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.