Cooling plates and semiconductor apparatus thereof
US9091491B2 · kind B2 · utility
7Cited by
4References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2008 |
| Grant date | Jul 28, 2015 |
| Priority date | — |
| Expiry date | Apr 26, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A cooling plate includes a channel to transmit a fluid, wherein the channel is disposed within a base and the channel has a first portion and a second portion. The first portion is disposed substantially along a peripheral edge of the base, and the second portion is coupled to the first portion and is disposed further away from the peripheral edge of the base than the first portion. The second portion has a length that is at least about 35% as long as the length of the first portion. The cooling plate also includes a lid disposed over the base and the channel, wherein the lid provides support for a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.