Patent · US Active

Communication system die stack

US9091820B2 · kind B2 · utility

7Cited by

48References

20Claims

0Family size

Assignee

Freeescale Semiconductor, Inc. · US

Inventors

Tab A. Stephens · Kyle, US
Perry H. Pelley · Austin, US
Michael B. McShane · Austin, US

Key dates

Filing date	Jun 10, 2013
Grant date	Jul 28, 2015
Priority date	—
Expiry date	Sep 2, 2033

Classification

Technology area (CPC G)Physics
CPC primaryG02B26/0833
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A high density, low power, high performance information system, method and apparatus are described in which perpendicularly oriented processor and memory die stacks (130, 140, 150, 160, 170) include integrated deflectable MEMS optical beam waveguides (e.g., 190) at each die edge to provide optical communications (182-185) in and between die stacks by supplying deflection voltages to a plurality of deflection electrodes (195-197) positioned on and around each MEMS optical beam waveguide (193-194) to provide two-dimensional alignment and controlled feedback to adjust beam alignment and establish optical communication links between die stacks.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.