Method and apparatus for liquid treatment of wafer shaped articles
US9093482B2 · kind B2 · utility
6Cited by
9References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2012 |
| Grant date | Jul 28, 2015 |
| Priority date | — |
| Expiry date | Oct 4, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68785
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an apparatus and process for treating wafer-shaped articles, a spin chuck holds a wafer-shaped article in a predetermined orientation relative to an upper surface of the spin chuck. A heating assembly comprises a housing containing at least one infrared heating element. The heating assembly is mounted above the upper surface of the spin chuck and adjacent a wafer-shaped article when mounted on the spin chuck. The housing also contains a conduit having an inlet connected to a source of cooling fluid and an outlet returning cooling fluid to the source of cooling fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.