Patent · US Active

Doped semiconductor films and processing

US9099423B2 · kind B2 · utility

397Cited by
13References
28Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 30, 2013
Grant dateAug 4, 2015
Priority date
Expiry dateDec 30, 2033

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/32135
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method of forming a semiconductor material incorporating an electrical dopant is disclosed. In one aspect, a method of incorporating dopant in a semiconductor film comprises forming a first semiconductor material incorporating the dopant at a first dopant concentration and preferentially etching a portion of the first semiconductor material, wherein etching leaves a first etched semiconductor material incorporating the dopant at a second dopant concentration higher than the first dopant concentration.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.