Semiconductor package with conductive carrier integrated heat spreader
US9111921B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2013 |
| Grant date | Aug 18, 2015 |
| Priority date | — |
| Expiry date | Nov 28, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one implementation, a semiconductor package includes a control conductive carrier having a die side and an opposite input/output (I/O) side connecting the semiconductor package to a mounting surface. The semiconductor package also includes a control FET of a power converter switching stage having a control drain attached to the die side of the control conductive carrier. The control conductive carrier is configured to sink heat produced by the control FET into the mounting surface. The semiconductor package includes a sync conductive carrier having another die side and another opposite I/O side connecting the semiconductor package to the mounting surface, and a sync FET of the power converter switching stage having a sync source attached to the die side of the sync conductive carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.