Daniel Cutler
12Patents
3h-index
10Co-inventors
57Inventor score
Filing activity: Dec 10, 1990 → Feb 9, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5100325A | Apparatus and method for creating perspective drawings | Physics | 12 | Expired |
| US9159703B2 | Power converter package including vertically stacked driver IC | Electricity | 8 | Active |
| US8143729B2 | Autoclave capable chip-scale package | Electricity | 3 | Active |
| US9269655B2 | Method for fabricating a semiconductor package with conductive carrier integrated heat spreader | Electricity | 2 | Active |
| US9111921B2 | Semiconductor package with conductive carrier integrated heat spreader | Electricity | 2 | Active |
| US9299690B2 | Method for fabricating a power semiconductor package including vertically stacked driver IC | Electricity | 1 | Active |
| US9576887B2 | Semiconductor package including conductive carrier coupled power switches | Electricity | 0 | Active |
| US9362221B2 | Surface mountable power components | Electricity | 0 | Active |
| US9012990B2 | Surface mountable power components | Electricity | 0 | Active |
| US9502395B2 | Power semiconductor package having vertically stacked driver IC | Electricity | 0 | Active |
| US9673109B2 | Method for fabricating a semiconductor package with conductive carrier integrated heat spreader | Electricity | 0 | Active |
| US9397212B2 | Power converter package including top-drain configured power FET | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.