Patent · US Active

Device for embossing of substrates

US9116424B2 · kind B2 · utility

2Cited by

1References

12Claims

0Family size

Assignee

EV GROUP E. THALLNER GMBH · AT

Inventors

Friedrich Paul Lindner · Ried im Innkreis, AT
Thomas Glinsner · Ried im Innkreis, AT
Markus Wimplinger · Ried im Innkreis, AT

Key dates

Filing date	Aug 18, 2010
Grant date	Aug 25, 2015
Priority date	—
Expiry date	Mar 5, 2032

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB29K2105/24
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

The invention relates to a device for embossing of substrates, especially semiconductor substrates or wafers, comprised of:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.