Method and apparatus for plating solution analysis and control
US9128493B2 · kind B2 · utility
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2References
20Claims
0Family size
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Key dates
| Filing date | Dec 12, 2008 |
| Grant date | Sep 8, 2015 |
| Priority date | — |
| Expiry date | Jun 7, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/8416
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A plating system comprises a plating solution and an apparatus for control of the plating solution, the apparatus including a Raman spectrometer for measurement of organic components, a visible light spectrometer for measurement of metallic components, and a pH probe. The plating solution can be sampled continuously or at intervals. Dosing of the plating solution adjusts for components consumed or lost in the plating process. The method of dosing is based on maintaining a desired composition of the plating solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.