Device for holding wafer shaped articles
US9130002B2 · kind B2 · utility
0Cited by
9References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 2010 |
| Grant date | Sep 8, 2015 |
| Priority date | — |
| Expiry date | Mar 15, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68792
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A spin chuck for holding semiconductor wafers includes one or more damping mechanisms to limit the force with which chuck pins impact the wafer edge following wafer shift. The damping mechanism may be a linear or rotary dashpot. The dashpot or dashpots are mounted on a surface of the chuck body and include a control arm that contacts a common gear ring that in turn drives the chuck pins during radially inward and outward movement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.