Thin polishing pad with window and molding process
US9138858B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2013 |
| Grant date | Sep 22, 2015 |
| Priority date | — |
| Expiry date | Jul 23, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/013
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad is described that has a polishing layer with a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The window has a top surface coplanar with the polishing surface and a bottom surface coplanar with a lower surface of the adhesive layer. A method of making a polishing pad includes forming an aperture through a polishing layer and an adhesive layer, securing a backing piece to the adhesive layer on a side opposite a polishing surface of the polishing layer, dispensing a liquid polymer into the aperture, and curing the liquid polymer to form a window.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.