Soft polishing pad for polishing a semiconductor substrate
US9156124B2 · kind B2 · utility
35Cited by
128References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2010 |
| Grant date | Oct 13, 2015 |
| Priority date | — |
| Expiry date | Nov 18, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2457/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Soft polishing pads for polishing semiconductor substrates are described. A soft polishing pad includes a molded homogeneous polishing body having a thermoset, closed cell polyurethane material with a hardness approximately in the range of 20 Shore D to 45 Shore D.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.