Patent · US Active

Matrix lid heatspreader for flip chip package

US9159643B2 · kind B2 · utility

0Cited by

29References

13Claims

0Family size

Assignee

Freeescale Semiconductor, Inc. · US

Inventors

George R. Leal · Cedar Park, US
Tim V. Pham · Austin, US

Key dates

Filing date	Sep 14, 2012
Grant date	Oct 13, 2015
Priority date	—
Expiry date	Sep 14, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method and apparatus are provided for manufacturing a lead frame based thermally enhanced flip chip package with an exposed heat spreader lid array (310) designed for direct attachment to an array of integrated circuit die (306) by including a thermal interface adhesion layer (308) to each die (306) and encapsulating the attached heat spreader lid array (310) and array of integrated circuit die (306) with mold compound (321) except for planar upper lid surfaces of the heat spreader lids (312).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.