Crack stopper on under-bump metallization layer
US9159686B2 · kind B2 · utility
8Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2012 |
| Grant date | Oct 13, 2015 |
| Priority date | — |
| Expiry date | Apr 10, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor die includes a crack stopper on an under-bump metallization (UBM) layer. The crack stopper is in the shape of hollow cylinder with at least two openings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.