Patent · US Active

Method for permanently bonding wafers

US9159717B2 · kind B2 · utility

3Cited by

0References

19Claims

0Family size

Assignee

EV GROUP E. THALLNER GMBH · AT

Inventors

Thomas Plach · Linz, AT
Kurt Hingerl · Steyr, AT
Markus Wimplinger · Ried im Innkreis, AT
Christoph Flotgen · Pramerdorf, AT

Key dates

Filing date	Apr 8, 2011
Grant date	Oct 13, 2015
Priority date	—
Expiry date	Jun 12, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

This invention relates to a method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate, the second substrate having at least one reaction layer, with the following steps, especially the following sequence:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.