Chemical-mechanical planarization pad including patterned structural domains
US9162341B2 · kind B2 · utility
15Cited by
11References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 6, 2013 |
| Grant date | Oct 20, 2015 |
| Priority date | — |
| Expiry date | Aug 3, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An aspect of the present disclosure relates to a chemical mechanical planarization pad including a first domain and a second continuous domain wherein the first domain includes discrete elements regularly spaced within the second continuous domain. The pad may be formed by forming a plurality of openings for a first domain within a second continuous domain of the pad, wherein the openings are regularly spaced within the second domain, and forming the first domain within the plurality of openings in second continuous domain. In addition, the pad may be used in polishing a substrate with a polishing slurry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.