Semiconductor integrated device with mechanically decoupled active area and related manufacturing process
US9184138B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 18, 2012 |
| Grant date | Nov 10, 2015 |
| Priority date | — |
| Expiry date | Jul 19, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor integrated device is provided with: a die having a body of semiconductor material with a front surface, and an active area arranged at the front surface; and a package having a support element carrying the die at a back surface of the body, and a coating material covering the die. The body includes a mechanical decoupling region, which mechanically decouples the active area from mechanical stresses induced by the package; the mechanical decoupling region is a trench arrangement within the body, which releases the active area from an external frame of the body, designed to absorb the mechanical stresses induced by the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.