Organic coating to inhibit solder wetting on pillar sidewalls
US9190376B1 · kind B1 · utility
2Cited by
2References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 15, 2014 |
| Grant date | Nov 17, 2015 |
| Priority date | — |
| Expiry date | May 15, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/1369
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates generally to and more particularly, to a method of fabricating a pillar interconnect structure with non-wettable sidewalls and the resulting structure. More specifically, the present invention may include exposing only the sidewalls of a pillar to an organic material that reacts with metal of the pillar to form an organo-metallic layer on sidewalls of the pillar. The organo-metallic layer may prevent solder from wetting on the sidewalls of the pillar during subsequent bonding/reflow processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.