Patent · US Active

Chip package with passives

US9190389B2 · kind B2 · utility

12Cited by

20References

11Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Georg Meyer-Berg · Birkenfeld, DE
Joachim Mahler · Regensburg, DE
Khalil Hosseini · Weihmichl, DE

Key dates

Filing date	Jul 26, 2013
Grant date	Nov 17, 2015
Priority date	—
Expiry date	Jul 26, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19043
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A chip package device includes an electrically conducting chip carrier, at least one semiconductor chip attached to the electrically conducting chip carrier, and an insulating laminate structure embedding the chip carrier, the at least one semiconductor chip and a passive electronic device. The passive electronic device includes a first structured electrically conducting layer, the first structured electrically conducting layer extending over a surface of the laminate structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.