In-situ monitoring system with monitoring of elongated region
US9205527B2 · kind B2 · utility
4Cited by
6References
19Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 8, 2013 |
| Grant date | Dec 8, 2015 |
| Priority date | — |
| Expiry date | Sep 16, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/048
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of chemical mechanical polishing a substrate includes polishing a layer on the substrate at a polishing station, monitoring the layer during polishing at the polishing station with an in-situ monitoring system, the in-situ monitoring system monitoring an elongated region and generating a measured signal, computing an angle between a primary axis of the elongated region and a tangent to an edge of the substrate, modifying the measured signal based on the angle to generate a modified signal, and at least one of detecting a polishing endpoint or modifying a polishing parameter based on the modified signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.