Die edge side connection

US9209143B2 · kind B2 · utility

Assignee

• Intel IP Corporation · US

Inventors

• Georg Seidemann · Landshut, DE
• Sven Albers · Regensburg, DE
• Teodora Ossiander · Sinzing, DE
• Michael P. Skinner · San Jose, US
• Hans-Joachim Barth · Munich, DE
• Harald Gossner · Riemerling, DE
• Reinhard Mahnkopf · Oberhaching, DE
• Christian Mueller · Wiesbaden, DE
• Wolfgang Molzer · Ottobrunn, DE

Key dates

• Filing date: Sep 26, 2013
• Grant date: Dec 8, 2015
• Expiry date: Sep 26, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/1434
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An apparatus comprises a first integrated circuit (IC) die that includes a top layer, a bottom surface, a sidewall surface extending from a top surface of the top layer to the bottom surface, and at least one multi-surface contact pad, a second IC die including a top layer, a bottom surface, a sidewall surface extending from a top surface of the top layer to the bottom surface, and at least one multi-surface contact pad, wherein the second IC die is arranged adjacent to the first IC die, and includes an electrically conductive bond in contact with at least one of the top surface or the side surface of the multi-surface contact pad of the first IC die and the top surface of the multi-surface contact pad of the second IC die.