Patent · US Active

Polishing pad with concentric or approximately concentric polygon groove pattern

US9211628B2 · kind B2 · utility

20Cited by
12References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 26, 2011
Grant dateDec 15, 2015
Priority date
Expiry dateMay 23, 2034

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB24D11/001
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

Polishing pads with concentric or approximately concentric polygon groove patterns are described. Methods of fabricating polishing pads with concentric or approximately concentric polygon groove patterns are also described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.