Patent · US Active

Electrolytic copper process using anion permeable barrier

US9234293B2 · kind B2 · utility

0Cited by
48References
12Claims
0Family size

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Key dates

Filing dateOct 6, 2014
Grant dateJan 12, 2016
Priority date
Expiry dateOct 6, 2034

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K3/423
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and a counter electrode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, a counter electrode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.