Soft and conditionable chemical mechanical window polishing pad

US9238295B2 · kind B2 · utility

Assignees

• Rohm and Haas Electronic Materials CMP Holdings, Inc. · US
• DOW GLOBAL TECHNOLOGIES LLC · US

Inventors

• Bainian Qian · Newark, US
• Michelle Jensen · Newark, US
• Marty W. DeGroot · Middletown, US
• Angus Repper · McKeesport, US
• James Murnane · Norristown, US
• Jeffrey James Hendron · Elkton, US
• John G. Nowland · Elkton, US
• David B. James · Newark, US
• Fengji Yeh · Wilmington, US

Key dates

• Filing date: May 31, 2013
• Grant date: Jan 19, 2016
• Expiry date: Dec 7, 2033

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08G18/6644
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A chemical mechanical polishing pad is provided containing: a polishing layer; a plug in place endpoint detection window block; a rigid layer; and, a hot melt adhesive bonding the polishing layer to the rigid layer; wherein the polishing layer comprises the reaction product of ingredients, including: a polyfunctional isocyanate; and, a curative package; wherein the curative package contains an amine initiated polyol curative and a high molecular weight polyol curative; wherein the polishing layer exhibits a density of greater than 0.6 g/cm3; a Shore D hardness of 5 to 40; an elongation to break of 100 to 450%; and, a cut rate of 25 to 150 μm/hr; and, wherein the polishing layer has a polishing surface adapted for polishing the substrate. Also provide are methods of making and using the chemical mechanical polishing pad.