Inventor · Wilmington, DE, US

Fengji Yeh

13Patents

4h-index

30Co-inventors

52Inventor score

Filing activity: Nov 1, 2012 → Aug 8, 2018

Most-cited inventions

Patent	Title	Area	Cited by	Status
US9259820B2	Chemical mechanical polishing pad with polishing layer and window	Electricity	32	Active
US8980749B1	Method for chemical mechanical polishing silicon wafers	Performing Operations; Transporting	17	Active
US9064806B1	Soft and conditionable chemical mechanical polishing pad with window	Emerging Cross-Sectional Technologies	7	Active
US9144880B2	Soft and conditionable chemical mechanical polishing pad	Chemistry; Metallurgy	4	Active
US9102034B2	Method of chemical mechanical polishing a substrate	Electricity	3	Active
US9238295B2	Soft and conditionable chemical mechanical window polishing pad	Chemistry; Metallurgy	2	Active
US9233451B2	Soft and conditionable chemical mechanical polishing pad stack	Chemistry; Metallurgy	1	Active
US9238296B2	Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer	Chemistry; Metallurgy	1	Active
US9776300B2	Chemical mechanical polishing pad and method of making same	Performing Operations; Transporting	0	Active
US10105825B2	Method of making polishing layer for chemical mechanical polishing pad	Performing Operations; Transporting	0	Active
US9586305B2	Chemical mechanical polishing pad and method of making same	Emerging Cross-Sectional Technologies	0	Active
US10144115B2	Method of making polishing layer for chemical mechanical polishing pad	Performing Operations; Transporting	0	Active
US10875144B2	Chemical mechanical polishing pad	Electricity	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.