Anneal module for semiconductor wafers

US9245767B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Vincent Steffan Francischetti · Columbia Falls, US
• Gregory J. Wilson · Kalispell, US
• Kyle M. Hanson · Kalispell, US
• Paul Z. Wirth · Kalispell, US
• Robert B. Moore · Bigfork, US

Key dates

• Filing date: Sep 12, 2013
• Grant date: Jan 26, 2016
• Expiry date: Jul 3, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67748
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An anneal module for annealing semiconductor material wafers and similar substrates reduces particle contamination and oxygen ingress while providing uniform heating including for 500° C. processes. The anneal module may include a process chamber formed in a metal body having internal cooling lines. A hot plate has a pedestal supported on a thermal choke on the body. A gas distributor in the lid over the hot plate flows gas uniformly over the wafer. A transfer mechanism moves a hoop to shift the wafer between the hot plate and a cold plate.