Polishing pad with alignment feature
US9249273B2 · kind B2 · utility
0Cited by
11References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2015 |
| Grant date | Feb 2, 2016 |
| Priority date | — |
| Expiry date | Jan 30, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2201/022
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Polishing pads with alignment marks are described. Methods of fabricating polishing pads with alignment marks are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.