Chemical mechanical polishing pad with polishing layer and window

US9259820B2 · kind B2 · utility

Assignees

• Rohm and Haas Electronic Materials CMP Holdings, Inc. · US
• DOW GLOBAL TECHNOLOGIES LLC · US

Inventors

• Bainian Qian · Newark, US
• Marty W. DeGroot · Middletown, US
• James Murnane · Norristown, US
• Angus Repper · McKeesport, US
• Michelle Jensen · Newark, US
• Jeffrey James Hendron · Elkton, US
• John G. Nowland · Elkton, US
• David B. James · Newark, US
• Fengji Yeh · Wilmington, US

Key dates

• Filing date: Mar 28, 2014
• Grant date: Feb 16, 2016
• Expiry date: May 31, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/30625
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A chemical mechanical polishing pad is provided having a polishing layer; and an endpoint detection window incorporated into the chemical mechanical polishing pad, wherein the endpoint detection window is a plug in place window; wherein the endpoint detection window comprises a reaction product of ingredients, comprising: a window prepolymer, and, a window curative system, comprising: at least 5 wt % of a window difunctional curative; at least 5 wt % of a window amine initiated polyol curative; and, 25 to 90 wt % of a window high molecular weight polyol curative.