Optical wafer and die probe testing

US9261556B2 · kind B2 · utility

Assignee

• Freeescale Semiconductor, Inc. · US

Inventors

• Michael B. McShane · Austin, US
• Perry H. Pelley · Austin, US
• Tab A. Stephens · Kyle, US

Key dates

• Filing date: Jun 10, 2013
• Grant date: Feb 16, 2016
• Expiry date: Jun 10, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L22/12
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

An optical die probe wafer testing circuit arrangement and associated testing methodology are described for mounting a production test die (157) and surrounding scribe grid (156) to a test head (155) which is positioned over a wafer (160) in alignment with a die under test (163) and surrounding scribe grid (161, 165), such that one or more optical deflection mirrors (152, 154) in the test head scribe grid (156) are aligned with one or more optical deflection mirrors (162, 164) in the scribe grid (161, 165) for the die under test (163) to enable optical die probe testing on the die under test (163) by directing a first optical test signal (158) from the production test die (157), through the first and second optical deflection mirrors (e.g., 152, 162) and to the first die.