Temporary liquid thermal interface material for surface tension adhesion and thermal control
US9269603B2 · kind B2 · utility
1Cited by
34References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 9, 2013 |
| Grant date | Feb 23, 2016 |
| Priority date | — |
| Expiry date | May 9, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68381
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An assembly including a liquid thermal interface material for surface tension adhesion and thermal control used during electrical/thermal test of a 3D wafer and methods of use. The method includes temporarily attaching a thinned wafer to a carrier wafer by applying a non-adhesive material therebetween and pressing the thinned wafer and the blank silicon-based carrier wafer together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.