Semiconductor system assemblies and methods of operation
US9287095B2 · kind B2 · utility
152Cited by
598References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2013 |
| Grant date | Mar 15, 2016 |
| Priority date | — |
| Expiry date | Dec 17, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32136
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An exemplary semiconductor processing system may include a remote plasma source coupled with a processing chamber having a top plate. An inlet assembly may be used to couple the remote plasma source with the top plate and may include a mounting assembly, which in embodiments may include at least two components. The inlet assembly may further include a precursor distribution assembly defining a plurality of distribution channels fluidly coupled with an injection port.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.