Srinivas D. Nemani
234Patents
39h-index
243Co-inventors
93Inventor score
Filing activity: Nov 13, 1996 → Feb 20, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6413583B1 | Formation of a liquid-like silica layer by reaction of an organosilicon compound and a hydroxyl forming compound | Electricity | 641 | Expired |
| US7541297B2 | Method and system for improving dielectric film quality for void free gap fill | Electricity | 625 | Active |
| US8242031B2 | High quality silicon oxide films by remote plasma CVD from disilane precursors | Chemistry; Metallurgy | 551 | Active |
| US6347636B1 | Methods and apparatus for gettering fluorine from chamber material surfaces | Emerging Cross-Sectional Technologies | 530 | Expired |
| US7749563B2 | Two-layer film for next generation damascene barrier application with good oxidation resistance | Electricity | 448 | Expired |
| US5812403A | Methods and apparatus for cleaning surfaces in a substrate processing system | Chemistry; Metallurgy | 341 | Expired |
| US6465366B1 | Dual frequency plasma enhanced chemical vapor deposition of silicon carbide layers | Electricity | 282 | Expired |
| US6764958B1 | Method of depositing dielectric films | Emerging Cross-Sectional Technologies | 281 | Expired |
| US6537733B2 | Method of depositing low dielectric constant silicon carbide layers | Electricity | 258 | Expired |
| US7790634B2 | Method for depositing and curing low-k films for gapfill and conformal film applications | Electricity | 215 | Active |
| US6114216A | Methods for shallow trench isolation | Electricity | 193 | Expired |
| US8980758B1 | Methods for etching an etching stop layer utilizing a cyclical etching process | Electricity | 187 | Active |
| US8895449B1 | Delicate dry clean | Electricity | 181 | Active |
| US9269590B2 | Spacer formation | Electricity | 180 | Active |
| US5935340A | Method and apparatus for gettering fluorine from chamber material surfaces | Chemistry; Metallurgy | 171 | Expired |
| US5963840A | Methods for depositing premetal dielectric layer at sub-atmospheric and high temperature conditions | Electricity | 167 | Expired |
| US9287095B2 | Semiconductor system assemblies and methods of operation | Electricity | 152 | Active |
| US9385028B2 | Air gap process | Electricity | 143 | Active |
| US9165783B2 | Method of patterning a low-k dielectric film | Electricity | 117 | Active |
| US8748322B1 | Silicon oxide recess etch | Electricity | 115 | Active |
| US8802572B2 | Method of patterning a low-k dielectric film | Electricity | 115 | Active |
| US9543163B2 | Methods for forming features in a material layer utilizing a combination of a main etching and a cyclical etching process | Electricity | 113 | Active |
| US9865484B1 | Selective etch using material modification and RF pulsing | Electricity | 109 | Active |
| US9478433B1 | Cyclic spacer etching process with improved profile control | Electricity | 106 | Active |
| US9093389B2 | Method of patterning a silicon nitride dielectric film | Electricity | 103 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.