Patent · US Active

Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips

US9293423B2 · kind B2 · utility

5Cited by

31References

15Claims

0Family size

Assignee

Intel Deutschland GmbH · DE

Inventors

Markus Brunnbauer · Lappersdorf, DE
Thorsten Meyer · Regensburg, DE
Stephan Bradl · Regensburg, DE
Ralf Plieninger · Poing, DE
Jens Pohl · San Luis Obispo, US
Klaus Pressel · Regensburg, DE
Recai Sezi · Simmerath, DE

Key dates

Filing date	Jul 14, 2014
Grant date	Mar 22, 2016
Priority date	—
Expiry date	Jul 14, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A workpiece has at least two semiconductor chips, each semiconductor chip having a first main surface, which is at least partially exposed, and a second main surface. The workpiece also comprises an electrically conducting layer, arranged on the at least two semiconductor chips, the electrically conducting layer being arranged at least on regions of the second main surface, and a molding compound, arranged on the electrically conducting layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.