Electronic module assembly with patterned adhesive array
US9293439B2 · kind B2 · utility
0Cited by
8References
7Claims
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Assignee
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Key dates
| Filing date | Dec 11, 2014 |
| Grant date | Mar 22, 2016 |
| Priority date | — |
| Expiry date | Dec 11, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved electronic module assembly and method of fabrication is disclosed. A patterned array of adhesive is deposited on a laminate, to which a chip is attached. Each region of adhesive is referred to as a lid tie. A lid is placed on the laminate, and is in contact with the lid ties. The lid ties serve to add stability to the laminate and reduce flexing during thermal processing and mechanical stress.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.