Contact pads for integrated circuit packages

US9299672B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Sven Albers · Regensburg, DE
• Georg Seidemann · Landshut, DE
• Sonja Koller · Regensburg, DE
• Stephan Stoeckl · Schwandorf, DE
• Shubhada H. Sahasrabudhe · Gilbert, US
• Sandeep B. Sane · Chandler, US

Key dates

• Filing date: May 16, 2014
• Grant date: Mar 29, 2016
• Expiry date: May 16, 2034

Classification

• Technology area (CPC —): General

Abstract

Disclosed herein are contact pads for use with integrated circuit (IC) packages. In some embodiments, a contact pad disclosed herein may be disposed on a substrate of an IC package, and may include a metal projection portion and a metal recess portion. Each of the metal projection portion and the metal recess portion may have a solder contact surface. The solder contact surface of the metal recess portion may be spaced away from the solder contact surface of the metal projection portion. Related devices and techniques are also disclosed herein, and other embodiments may be claimed.