Accommodating device for retaining wafers
US9312161B2 · kind B2 · utility
19Cited by
2References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2010 |
| Grant date | Apr 12, 2016 |
| Priority date | — |
| Expiry date | May 13, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A receiving means for receiving and mounting of wafers. The receiving means includes a mounting surface. A mounting means is provided for mounting a wafer on the mounting surface. A compensation means is provided for active, especially locally controllable, at least partial compensation of local and/or global distortions of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.