High temperature electrostatic chuck with radial thermal chokes
US9337067B2 · kind B2 · utility
10Cited by
8References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 9, 2012 |
| Grant date | May 10, 2016 |
| Priority date | — |
| Expiry date | Feb 23, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer support assembly including a wafer support and cooling plate with radial thermal chokes is provided. The cooling plate and wafer support may have limited contact and may not contact each other outside of certain limited thermal contact patches. The thermal contact patches may generally define one or more radial thermal choke regions. In some implementations, high- and low-temperature cooling systems may be placed at one or more locations across the cooling plate to assist in temperature management.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.