Patent · US Active

Transferring heat through an optical layer of integrated circuitry

US9337122B2 · kind B2 · utility

0Cited by

5References

21Claims

0Family size

Assignee

GlobalFoundries Inc. · KY

Inventors

Harry Barowski · Balingen, DE
Thomas J. Brunschwiler · Thalwil, CH
Roger F. Dangel · Zug, CH
Hubert Harrer · Böblingen, DE
Andreas Huber · Holzgerlingen, DE
Norbert M. Meier · Thalwil, CH
Bruno Michel · Thalwil, CH
Tim Niggemeier · Laatzen, DE
Stephan Paredes · Thalwil, CH
Jochen Supper · Herrenberg, DE
Jonas R. Weiss · Thalwil, CH

Key dates

Filing date	Feb 26, 2015
Grant date	May 10, 2016
Priority date	—
Expiry date	Feb 26, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15311
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A computer program product or hardware description language (“HDL”) design structure in a computer-aided design system for generating a functional design model of an integrated circuitry structure including generating a functional representation of at least first and second regions of the integrated circuitry structure, generating a functional representation of an optical layer comprising optical waveguides, and generating a functional representation of a heat-conductive material for transferring heat from at least the second region through the optical layer to a heat sink.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.