Process kit shield for plasma enhanced processing chamber
US9343274B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2014 |
| Grant date | May 17, 2016 |
| Priority date | — |
| Expiry date | Feb 11, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12528
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Apparatus for processing substrates is disclosed herein. In some embodiments, an apparatus includes a first shield having a first end, a second end, and one or more first sidewalls disposed between the first and second ends, wherein the first end is configured to interface with a first support member of a process chamber to support the first shield in a position such that the one or more first sidewalls surround a first volume of the process chamber; and a second shield having a first end, a second end, and one or more second sidewalls disposed between the first and second ends of the second shield and about the first shield, wherein the first end of the second shield is configured to interface with a second support member of the process chamber to support the second shield such that the second shield contacts the first shield to form a seal therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.