Detecting defects on a wafer
US9355208B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2014 |
| Grant date | May 31, 2016 |
| Priority date | — |
| Expiry date | Jul 1, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/30
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Systems and methods for detecting defects on a wafer are provided. One method includes determining locations of all instances of a weak geometry in a design for a wafer. The locations include random, aperiodic locations. The weak geometry includes one or more features that are more prone to defects than other features in the design. The method also includes scanning the wafer with a wafer inspection system to thereby generate output for the wafer with one or more detectors of the wafer inspection system. In addition, the method includes detecting defects in at least one instance of the weak geometry based on the output generated at two or more instances of the weak geometry in a single die on the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.