Integrated circuit packaging system with interposer structure and method of manufacture thereof
US9355983B1 · kind B1 · utility
4Cited by
1References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2014 |
| Grant date | May 31, 2016 |
| Priority date | — |
| Expiry date | Jun 27, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1533
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system and a method of manufacture thereof of integrated circuit packaging system, including: a pillar; a conductive buildup attached to the pillar; and a molded body encapsulating the conductive buildup, the pillar extending out of the molded body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.