Wire bonding device and method of eliminating defective bonding wire
US9355989B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Dec 29, 2014 |
| Grant date | May 31, 2016 |
| Priority date | — |
| Expiry date | Dec 29, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/386
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of eliminating a defective bonding wire is provided, including moving a bonding member from a first region of a carrier to a second region of the carrier if the bonding wire of the bonding member is defective, and cooperatively operating a movement member and the bonding member so as to cause the defective bonding wire to be removed from the bonding member and bonded to the second region of the carrier, thereby auto-debugging the bonding member and improving the production efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.