Data perturbation for wafer inspection or metrology setup using a model of a difference
US9360863B2 · kind B2 · utility
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2References
39Claims
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Key dates
| Filing date | Jun 9, 2011 |
| Grant date | Jun 7, 2016 |
| Priority date | — |
| Expiry date | Jul 19, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
Various embodiments for determining parameters for wafer inspection and/or metrology are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.