Systems and methods for providing wafer access in a wafer processing system

US9373533B2 · kind B2 · utility

Assignee

• Cascade Microtech, Inc. · US

Inventors

• Frank Fehrmann · Hengshan, TW
• Botho Hirschfeld · Dresden, DE
• Stojan Kanev · Sacka, DE

Key dates

• Filing date: Dec 27, 2013
• Grant date: Jun 21, 2016
• Expiry date: May 27, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67775
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Systems and methods for providing wafer access in a wafer processing system are disclosed herein. The methods may include docking a first wafer cassette on the wafer processing system and removing a selected wafer from the first wafer cassette with the wafer processing system. The methods further may include performing a process operation on the selected wafer with the wafer processing system and undocking the first wafer cassette from the wafer processing system while performing the process operation. The methods also may include docking a second wafer cassette (which may be the same as or different from the first wafer cassette) on the wafer processing system, inventorying the second wafer cassette with the wafer processing system, and/or subsequently placing the selected wafer in the second wafer cassette. The systems may include wafer processing systems that include a controller that is programmed to perform at least a portion of the methods.