Adjustment of polishing rates during substrate polishing with predictive filters
US9375824B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2013 |
| Grant date | Jun 28, 2016 |
| Priority date | — |
| Expiry date | Aug 1, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B11/0625
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A measured characterizing value dependent on a thickness of a region of a substrate is input into a first predictive filter. The first predictive filter generates a filtered characterizing value. A measured characterizing rate at which the measured characterizing value changes is input into a second predictive filter. The second predictive filter generates a filtered characterizing rate of the region of the substrate. The measured characterizing value and the measured characterizing rate are determined based on in-situ measurements made at or before a first time during a polishing process of the substrate. A desired characterizing rate is determined to be used for polishing the region of the substrate after the first time and before a second, later time based on the filtered characterizing value and the filtered characterizing rate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.