Method for forming doped areas under transistor spacers
US9379213B2 · kind B2 · utility
2Cited by
1References
16Claims
0Family size
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Key dates
| Filing date | Aug 4, 2014 |
| Grant date | Jun 28, 2016 |
| Priority date | — |
| Expiry date | Aug 4, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/021
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Method for fabricating a transistor comprising the steps consisting of:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.