Patent · US Active

Overmolded substrate-chip arrangement with heat sink

US9385059B2 · kind B2 · utility

0Cited by

2References

19Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Peter Ossimitz · Munich, DE
Juergen Schaefer · Oberhaching, DE
Liu Chen · Munich, DE
Markus Dinkel · Unterhaching, DE
Stefan Macheiner · Kissing, DE

Key dates

Filing date	Aug 28, 2013
Grant date	Jul 5, 2016
Priority date	—
Expiry date	Apr 12, 2034

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49146
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic device comprises a substrate, at least one electronic chip mounted on and electrically connected to the substrate and being configured as a system control unit for controlling a connected system, a heat removal structure thermally connected to the at least one electronic chip and configured for removing heat generated by the at least one electronic chip upon operation of the electronic device, and an overmolding structure configured for at least partially encapsulating at least the at least one electronic chip and the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.