Method of inspecting a semiconductor substrate
US9390884B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 2014 |
| Grant date | Jul 12, 2016 |
| Priority date | — |
| Expiry date | Aug 13, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/24592
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor substrate inspection system includes an e-beam inspection system configured to deliver electrons to a specimen semiconductor substrate. A sensor is configured to detect reflected electrons that reflect off the surface of the specimen semiconductor substrate. An analysis unit is configured to determine a number of electrons received by the semiconductor substrate, and to determine at least one target region including at least one defect of the semiconductor substrate. A reference image module is in electrical communication with the analysis unit. The reference image module is configured to generate a first digital image having a plurality of pixels, and to adjust a gray-scale level of the pixels included in the target region based on the number electrons included in each pixel to generate a second digital image that excludes the at least one defect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.