Multi-gate FETs having corrugated semiconductor stacks and method of forming the same
US9391176B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2014 |
| Grant date | Jul 12, 2016 |
| Priority date | — |
| Expiry date | Oct 23, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/518
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides, in various aspects of the present disclosure, a semiconductor device which includes a semiconductor stack disposed over a surface of a substrate and a gate structure partially formed over an upper surface and two opposing sidewall surfaces of the semiconductor stack, wherein the semiconductor stack includes an alternating arrangement of at least two layers formed by a first semiconductor material and a second semiconductor material which is different from the first semiconductor material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.