Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9394620B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2014 |
| Grant date | Jul 19, 2016 |
| Priority date | — |
| Expiry date | Jun 18, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Described are apparatus and methods for electroplating one or more metals onto a substrate. Embodiments include electroplating apparatus configured for plating highly uniform metal layers. In specific embodiments, the apparatus includes a flow-shaping element made of an ionically resistive material and having a plurality of channels made through the flow shaping element. The channels allow for transport of the electrolyte through the flow shaping element during electroplating. The channel openings are arranged in a spiral-like pattern on the substrate-facing surface of the flow shaping element such that the center of the spiral-like pattern is offset from the center of the flow shaping element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.